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D1867-13 – Standard Test Method Technical Guide
ASTM D1867-13 provides the standard specification for copper-clad thermosetting laminates used primarily in the fabrication of printed wiring boards. This article outlines the essential classification parameters, material purity requirements, and ordering guidelines defined by the standard, focusing on grades, copper foil characteristics, and thickness tolerance classes.
🟦 Material Classification and Copper Foil Surfaces
The standard covers twelve grades of thermosetting laminate base, which must conform to the mechanical and electrical property requirements of the corresponding grade in Specification D709. The bonded copper foil surfaces are strictly controlled.
| 🟦 Material Property | 📏 Specification Requirement |
|---|---|
| Copper Foil Type | Rolled or Electrodeposited |
| Minimum Copper Purity | 99.50 % (Silver considered equal to copper) |
| Base Laminate Grades | Conforms to requirements in Specification D709 |
| Primary Application | Printed (etched) wiring or circuit boards |
Technical Note: When specifying copper weight, remember that the standard classifies foil by nominal weight. The thickness tolerances of the copper foil must conform to the requirements of Table 3 within the standard. Always verify the foil basis weight against the intended current-carrying capacity and etching requirements.
📐 Thickness Tolerance Classes and Compliance Criteria
ASTM D1867-13 defines two classes of overall laminate thickness tolerance. Class I reflects the tolerances of standard manufacturing practice. Class II represents a closer tolerance product suitable for high-precision printed wiring applications. Compliance is calculated based on sheet area and the distribution of thickness measurements.