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IEC 60194-2:2017 defines vocabulary for printed board design, manufacture, and assembly. This standard may look like “just a dictionary” — but it unifies the communication language between designers, fabricators, and assemblers across the global PCB industry.
Why unified terminology matters: One simple example — “Annular Ring” in PCB design refers to the minimum copper ring width around a pad; in fabrication it refers to the remaining copper ring after drilling (potentially reduced by drill wander); in IPC standards it is called “Minimum Annular Ring.” Same concept, three different names — batch rejection from design-to-manufacturing ambiguity is not uncommon. IEC 60194-2 standardizes these terms with precise bilingual (EN/FR) definitions.
Key term coverage: Base material, via, blind/buried via, microvia (≤150 μm), solder mask, surface finish (ENIG, HASL, OSP, etc.). Each term carries a rigorous technical definition with illustrations.
TN Lab — Good terminology standards are the foundation of engineering communication. A miscommunicated design defeats even the best manufacturing.