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ISO 27307:2015 specifies a transverse scratch testing method for evaluating the adhesion and cohesion of thermal sprayed ceramic coatings. The standard applies to coatings with thickness from 50 μm to over 1000 μm, including plasma-sprayed, HVOF, cold spray, and aerosol deposition coatings. The test involves drawing a Rockwell conical diamond indenter (20 μm tip radius) across a polished cross-section of the coated specimen under a constant applied load.
The scratch testing machine must provide rigid indenter mounting, controlled normal load application, and acoustic emission (AE) monitoring capability. Specimens are sectioned perpendicular to the coating surface, embedded in cold-mounting acrylic resin, and polished to Ra < 0.5 μm. Testing is performed under controlled environmental conditions (22 °C ± 2 °C, 50% ± 5% RH) with at least 4 scratches per specimen and 3 specimens per test condition.
| Parameter | Requirement | Purpose |
|---|---|---|
| Indenter geometry | Rockwell C, 20 μm tip radius | Standardized stress field |
| Surface finish | Ra < 0.5 μm | Eliminate roughness artifacts |
| Temperature | 22 °C ± 2 °C | Environmental control |
| Relative humidity | 50% ± 5% | Environmental control |
| Scratches per specimen | ≥ 4 | Statistical significance |
| Specimens per condition | ≥ 3 | Statistical significance |
Three primary failure modes are identified: (1) no crack — coating remains intact; (2) cohesive crack — failure within the coating layer; (3) adhesive crack — failure at the coating-substrate interface. The critical load for adhesive failure characterizes the practical coating adhesion strength. Acoustic emission and tangential force monitoring provide real-time detection during testing.
The transverse scratch test enables objective comparison of coating adhesion across different spray parameters, material systems, and substrate preparations. This is particularly valuable for quality control in aerospace, power generation, and biomedical coating applications. The standard includes classification criteria and optical micrograph reference examples for failure mode identification.