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SAE J473-2018 is a stabilized standard covering lead-tin solders with or without antimony. It provides composition grades, temperature ranges, and impurity limits to guide material selection for various applications. Understanding these specifications is key to achieving reliable solder joints while balancing cost and performance.
The standard defines multiple solder grades (1A to 9B) with varying tin and antimony content. Table 1 summarizes the compositions and melting ranges for common grades.
| SAE Grade | Tin (Sn) % | Antimony (Sb) % | Solidus (°F) | Liquidus (°F) |
|---|---|---|---|---|
| 1A | 45.0 | 0.4 max | 360 | 440 |
| 2A | 40.0 | 0.4 max | 360 | 455 |
| 3A | 30.0 | 0.5 max | 360 | 490 |
| 4A | 25.0 | 0.4 max | 360 | 510 |
| 5A | 20.0 | 0.4 max | 360 | 535 |
| 6A | 15.0 | 0.4 max | 435 | 555 |
| 7A | 51.0 | 0.4 max | 360 | 420 |
| 8A | 35.0 | 0.4 max | 360 | 475 |
| 9B | 2.75 | 4.90–5.40 | 465 | 555 |
Note: Class A solders have ≤0.4% Sb; Class B solders contain intentional Sb additions. See full standard for all grades.
When selecting a solder grade, consider both technical requirements and cost. Higher tin content improves wetting and narrows the semi-molten range, but increases expense. The standard recommends using the lowest tin grade that provides adequate flow and adhesion.
Design Hint: For many general applications, a grade like SAE 3A (30% Sn) offers good wetting at moderate cost. If joining components with tight thermal profiles, choose a solder with a narrow melting range—higher tin grades often deliver this.
Also, be mindful of the semi-molten range (difference between liquidus and solidus). A narrow range reduces the risk of joint movement during solidification, which is critical for high-reliability assemblies.
Material compatibility is crucial. Lead-tin solders are suitable for steel and copper alloys but have limitations with other metals.
⚠️ Important: Never use antimony-bearing solders (Class B) on galvanized steel or zinc. The resulting compounds can cause sudden joint failure under stress.
Additionally, adhere to impurity limits. For example, zinc must not exceed 0.005% and copper is limited to 0.08% (except in dipping solders where 0.5% is allowed due to bath pickup). Exceeding these limits can compromise joint integrity.
The standard specifies zinc ≤0.005% and aluminum ≤0.005%. Other impurities include bismuth ≤0.25%, copper ≤0.08% (0.5% for dipping), iron ≤0.02%, and total others ≤0.08%.
Only Class A solders (antimony content ≤0.4%) should be used on galvanized steel or zinc to avoid embrittlement from antimony-zinc intermetallics.
Lead-tin solders do not wet stainless steel adequately and can lead to weak joints. Pre-tinning with pure tin or higher-tin alloys is often necessary, or alternative soldering methods should be employed.
Antimony increases strength and hardness but can form brittle compounds with zinc. Therefore, antimony-bearing solders (Class B) are suitable for some applications but must be avoided on galvanized or zinc-coated surfaces.
For complete details, refer to the full SAE J473-2018 standard.