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ASTM D2861-14, issued under the fixed designation D2861, provides standardized test methods for evaluating flexible composites specifically designed for flexible and multilayer circuitry. These materials consist of copper foil combined with dielectric film or treated fabrics. The standard outlines critical procedures for assessing both the mechanical durability and the electrical integrity of these composites.
The scope of D2861-14 (Section 1.1) covers materials used in the manufacture of flexible or multilayer circuitry. The procedures defined within the standard address conditioning, specimen preparation, and the testing of the dielectric portion, as well as the peel strength, flex life, and strain relief properties of the composite. The standard establishes inch-pound units as the standard, with SI units provided for information.
| 📋 Procedure | 📄 Section | 📚 ASTM Reference |
|---|---|---|
| Conditioning | 5 | D6054 |
| Specimen Preparation | 6 | D1825 |
| Testing of the Dielectric Portion | 7 – 10 | D1825, D2305, D902 |
| Peel Strength of the Composite | 11 – 19 | — |
| Flex Life of the Composite | 20 – 25 | — |
| Strain Relief Due to Etching | 26 – 32 | — |
Proper conditioning is critical for reproducible results. Section 5.1 mandates that all conditioning and testing be conducted in the standard laboratory atmosphere specified in Practice D6054, with specimens conditioned for a minimum of 18 hours prior to testing. Specimen preparation (Section 6) requires etching without scrubbing per Practice D1825.
The electrical and mechanical characteristics of final circuits will, to a large extent, depend on the properties of the dielectric portion of the composite (Section 7.1). The test battery in D2861-14 evaluates the full spectrum of performance, from bond integrity to long-term flexural durability.
| 🎯 Property | 📐 Procedure Focus | ⚡ Significance |
|---|---|---|
| Peel Strength | Copper-to-Dielectric Adhesion | Measures force required to separate the copper foil from the base, critical for trace reliability. |
| Flex Life | Mechanical Endurance | Determines resistance to failure under repeated flexing, simulating real-world installation and use. |
| Strain Relief Due to Etching | Dimensional Stress Analysis | Evaluates dimensional stability and stress relaxation after the copper circuit pattern has been etched. |
| Dielectric Integrity | Insulation Performance | Follows D2305 and D902 to measure dielectric strength, permittivity, and dissipation factor of the base film or fabric. |
Adherence to these standardized methods ensures consistent quality control and performance validation for materials used in high-reliability flexible circuitry applications.
This standard covers flexible composites made from copper foil combined with either a dielectric film or a treated/impregnated fabric, which are commonly laminated to form flexible or multilayer circuit boards.
Section 5.1 explicitly requires that specimens be conditioned for a minimum of 18 hours in the standard laboratory atmosphere as defined by Practice D6054 before any testing can commence.
Specimens are prepared by etching without scrubbing, following the guidelines in Practice D1825. The standard cautions that etching reagents may be incompatible with some composite materials.
For the dielectric portion, the standard references Practice D2305 for testing polymeric films and Test Methods D902 for resin-coated glass fabrics and tapes, depending on the material construction.