Physical Address
304 North Cardinal St.
Dorchester Center, MA 02124
Physical Address
304 North Cardinal St.
Dorchester Center, MA 02124
This standard, designated ASTM D2739-97 (Reapproved 2017), defines a precise test method for evaluating the volume resistivity of cured, resin-based conductive adhesives. The measurement is performed directly on a thin adhesive layer as it would exist in a bonded assembly. This test method applies to adhesives cured under ambient conditions as well as those requiring elevated temperature curing, making it highly relevant for diverse electronic packaging applications. The standard emphasizes that the determined volume resistivity pertains specifically to the conductive adhesive in the context of a bonded joint.
The core apparatus required for this method is a Kelvin (Resistance) Bridge, which must be calibrated to 1% accuracy. The standard test specimen is created using metal tensile adhesion plugs (Fig. 1 of the standard). While the standard provides a specific configuration, alternative geometries and adherend materials are permissible provided similar strict tolerances are maintained. The choice of metal for the adherends is critical, as different metals inherently contribute different resistance values to the measurement. Conditioning of specimens should follow Practice D618 where applicable.
| 🛠️ Component | 📏 Specification & Notes |
|---|---|
| Resistance Bridge | Kelvin-type, required accuracy of 1% |
| Adherends | Metal tensile adhesion plugs (e.g., QQ-B-626 Comp 22 bronze per Fig. 1) |
| Supporting Docs | Terminology D907, Practice D618, Assembly Jig (ASTM Adjunct) |
The Summary of Test Method (Section 4) specifies that the volume resistivity of adhesive layers cured between metal adherends is measured directly on a resistance bridge. The resistance of this bonded assembly is then converted to volume resistivity (ρ) by factoring in the cross-sectional area (A) of the bond and the bondline thickness (l): ρ = R · (A / l). Using the precise definitions from Terminology D907 and referenced standards, conductivity is defined as the ratio of current density to the potential gradient, making it the reciprocal of volume resistivity.
| 📐 Key Term | ⚡ Definition (from ASTM D2739 & Supporting Standards) |
|---|---|
| Conductivity | The ratio of the current density carried through a specimen to the potential gradient paralleling the current. Reciprocal of resistivity. |
| Volume Resistivity | The ratio of the electric potential gradient to the current density when the gradient is parallel to the current in the material. |
Its purpose is to determine the volume resistivity of resin-based conductive adhesives in their cured state, specifically within a thin film bonded assembly. The scope covers adhesives cured at either room temperature or elevated temperatures. It is crucial for quality control and material screening in the electronics industry.
Accurate measurement of volume resistivity is vital for ensuring the electrical performance and reliability of conductive adhesives used in electronic packaging techniques. The standard explicitly states its importance for acceptance testing and screening of materials in this field.
Yes, with the agreement of the interested parties. However, different metals (e.g., copper, aluminum, bronze) provide inherently different resistance values. The standard provides a specific plug composition (QQ-B-626 Comp 22 bronze) as a reference geometry in Fig. 1. An assembly jig is also detailed as an ASTM adjunct.
Volume resistivity is defined in Terminology D907 and the standard as the ratio of the electric potential gradient to the current density when the gradient is parallel to the current in the material. It is the reciprocal of electrical conductivity. A low volume resistivity indicates a highly conductive adhesive.