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CISPR 14-2 specifies the electromagnetic immunity requirements for household appliances, electric tools, and similar apparatus. The standard defines three performance criteria for evaluating immunity test results. Criterion A applies during and after the test — the appliance continues to operate as intended, with no degradation of performance. Criterion B applies after the test — temporary degradation is allowed during the test, but the appliance must self-recover to normal operation after the disturbance ceases. Criterion C allows temporary loss of function, requiring manual intervention or system reset for recovery.
The standard covers electrostatic discharge (ESD), radiated RF electromagnetic fields, electrical fast transients (EFT), surges, conducted RF disturbances, and voltage dips/interruptions. The immunity levels are selected to represent the typical electromagnetic environment encountered by household appliances in residential, commercial, and light-industrial settings.
CISPR 14-2 references basic immunity standards (IEC 61000-4 series) for test methods while specifying the specific test levels applicable to household appliances.
| Phenomenon | Basic Standard | Test Level | Performance Criterion |
|---|---|---|---|
| ESD (contact) | IEC 61000-4-2 | ±4 kV (contact), ±8 kV (air) | B |
| Radiated RF (80–2700 MHz) | IEC 61000-4-3 | 10 V/m (80–2700 MHz) | A |
| EFT (power ports) | IEC 61000-4-4 | ±2 kV | B |
| EFT (signal/control ports) | IEC 61000-4-4 | ±1 kV | B |
| Surge (line-to-line) | IEC 61000-4-5 | ±1 kV | B |
| Surge (line-to-ground) | IEC 61000-4-5 | ±2 kV | B |
| Conducted RF (150 kHz–80 MHz) | IEC 61000-4-6 | 10 V (EMF) | A |
| Voltage dips (30%/60%) | IEC 61000-4-11 | 10 ms / 100 ms | B / C |
Designing for ESD immunity involves multiple layers of protection. At the enclosure level, all seams, vents, and openings should be designed with ESD mitigation in mind. A discharge path to chassis ground should be provided near all external connectors and user-accessible metal parts. PCB-level protection includes TVS diodes on all I/O lines (with response time < 1 ns), series resistors (10–100 Ω) on signal lines entering the microcontroller, and spark gaps on traces leading to external interfaces. Maintaining a creepage distance of at least 8 mm between external metal parts and internal circuits is recommended for ±8 kV air discharge.
For EFT and surge immunity, the primary defense is a well-designed power supply input filter. A common-mode choke (10–33 mH) combined with X-capacitors (0.1–0.47 µF) and Y-capacitors (2200–4700 pF) provides attenuation of fast transients. For surge protection, a metal oxide varistor (MOV) rated at 275 V AC (for 230 V supplies) or 130 V AC (for 120 V supplies) should be placed at the power input, before the bridge rectifier. Additional protection for switch-mode power supplies includes a transient voltage suppressor (TVS) diode on the DC bus after the rectifier.
Conducted RF immunity (150 kHz–80 MHz) requires careful attention to the analog signal chain. Sensor inputs (temperature, pressure, humidity) are particularly susceptible. Differential signaling with twisted-pair wiring and a common-mode choke at the sensor interface provides 20–30 dB of common-mode rejection. PCB layout techniques include keeping analog traces short and远离 high-speed digital traces, and implementing guard rings around sensitive analog circuits.