PD IEC TS 62878 — Device Embedded Substrate Technical Specifications

🔬 PD IEC TS 62878 is the UK implementation, published by BSI, of several technical specifications in the IEC 62878 series, prepared by UK Technical Committee EPL/501 (Electronic Assembly Technology) and focused on device embedded substrate, an advanced packaging and electronic assembly technology. The three parts in this batch are all “Guidelines”: Part 2-1, general description of the technology; Part 2-3, a design guide; and Part 2-4, guidelines for test element groups (TEG). Together they form a complete guideline system covering technology awareness, design, and reliability evaluation for device embedded substrates — an important reference in advanced packaging and high-density interconnection (HDI).

💡 A device embedded substrate embeds passive (and even active) devices directly inside the substrate instead of mounting them on the surface, significantly improving integration density, shortening interconnection distance, and improving electrical performance. It is a key technology direction for high-density electronic systems such as 5G, automotive electronics, and IoT.

1. Series Overview 📌

As electronic products move toward miniaturisation and higher performance, traditional surface-mount technology (SMT) increasingly hits limits in integration density, electrical performance, and heat dissipation. Device embedded substrates embed resistors, capacitors, inductors, filters, and even integrated circuits into inner substrate layers, achieving higher-density interconnection and better electrical performance. The IEC 62878 series develops technical specifications for this technology, which BSI adopts as “PD IEC/TS 62878-xxx”.

The three parts here — 2-1, 2-3, and 2-4 — are guideline technical specifications: Part 2-1 presents the technology overview and basic structures, Part 2-3 gives design-level requirements and recommendations, and Part 2-4 specifies the use of test element groups (TEG) for reliability evaluation.

2. Series Structure and Part Highlights 📋

Part	Document Title	IEC Edition	Core Content
Part 2-1	Guidelines — General description of technology	IEC TS 62878-2-1:2015 (Ed. 1.0)	Basic structures, manufacturing technology, Jisso mounting and interconnection, and terminology
Part 2-3	Guidelines — Design guide	IEC TS 62878-2-3:2015 (Ed. 1.0)	Substrate structure definition, layer definition, conductor spacing at terminals, conditions for base and embedded devices, and design specification
Part 2-4	Guidelines — Test element groups (TEG)	IEC TS 62878-2-4:2015 (Ed. 1.0)	Test conditions, sample preparation, classification of tests and evaluation, and test reports

All three parts are classified under ICS 31.180 (Printed circuit base materials) and ICS 31.190 (Assemblies of electric/electronic components), handled by the same UK technical committee EPL/501, following a “understand — design — evaluate” progression.

⚠️ This series comprises technical specifications (TS) of a guideline nature, aiming to unify technical awareness and engineering practice. They are not mandatory certification standards. Actual product design and production should combine specific process capability and reliability requirements.

3. Key Technical Requirements 🔧

1. General Description of Technology (Part 2-1)

Part 2-1 gives a general explanation of device embedded substrate technology, mainly including:

Basic structures: the basic structure of embedded substrates and how embedded devices (resistors, capacitors, ICs) are arranged among substrate layers;
Manufacturing technology: process routes for embedding devices, including conventional-process embedding and via-based embedding;
Jisso mounting and interconnection: mounting and interconnection technology for embedded substrates, plus the various interconnection and structure types;
Terminology: unifying terms for cross-vendor communication.

2. Design Guide (Part 2-3)

Part 2-3 addresses design engineers and specifies key requirements and recommendations for embedded substrate design:

Substrate structure: specification of the top and bottom surfaces and the definition of layers;
Conductor spacing at terminals: spacing requirements for conductors at embedded-device terminals to ensure manufacturability and electrical reliability;
Conditions for base and embedded devices: preparation conditions for the base and the devices to be embedded;
Recommendations for embedding devices: guidance on selecting devices for embedding;
Design specification: overall design rules covering layout, routing, and thermal and mechanical design considerations.

3. Test Element Groups (TEG) Guidelines (Part 2-4)

Test element groups (TEG) are dedicated test structures designed to evaluate process and reliability. Part 2-4 specifies how to use TEGs:

Test conditions: classification of tests and evaluation (mechanical, electrical, thermal), measuring environment, and test methods;
Specimens and number of specimens: preparation and quantity requirements for test specimens;
Evaluation methods: using TEG structures to evaluate the yield and reliability of the embedding process, providing a basis for design verification and volume production;
Test reports: requirements for recording and reporting test results.

🚨 Since embedded devices are difficult to rework once manufactured, design verification and reliability evaluation must be performed up-front. Using the Part 2-4 TEG structures to fully assess the process window and reliability before mass production significantly reduces the risk of batch failure.

4. Engineering Practice Applications 🛠️

🎯 Process selection: when evaluating device embedded substrate technology, use Part 2-1 to understand the technology route and capability boundaries, and decide whether it suits the target product (e.g., RF modules, power modules, sensor packaging).
📐 Design implementation: during layout design, refer to Part 2-3 to standardise stack-up structure, terminal spacing, and device placement, avoiding manufacturability and reliability problems.
🔬 Reliability verification: use the Part 2-4 TEG structures to evaluate the mechanical, electrical, and thermal reliability of the embedding process, establishing a basis for production release.
🤝 Supply-chain collaboration: unified terminology and design rules help collaboration among substrate makers, device makers, and system designers, shortening development cycles.

5. Frequently Asked Questions ❓

❓ Q: What is a device embedded substrate?
A: It is an advanced substrate technology in which passive devices (resistors, capacitors, inductors, etc.) — or even active devices — that would traditionally be mounted on the substrate surface are embedded into inner layers of the substrate, improving integration density, shortening interconnections, and improving electrical performance.

❓ Q: What is the purpose of TEG (test element groups)?
A: TEGs are dedicated test structures designed to evaluate the embedding process and reliability. By testing the mechanical, electrical, and thermal performance of TEGs, process yield and reliability can be assessed before mass production, guiding process optimisation and design improvement.

❓ Q: Which products suit embedded substrates?
A: Products requiring high integration, good electrical performance, and miniaturisation, such as smartphone RF modules, power-management modules, automotive electronics, 5G communication equipment, sensors, and medical electronics.

🔍 Q: Is this series mandatory?
A: No. They are technical specifications (TS) of a guideline nature, used to unify technical awareness and engineering practice. Design and production decisions should combine process capability, reliability, and cost.

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